---
product_id: 554205593
title: "Rubik Lead-Based BGA Rework Solder Paste 50g with Tin-Lead Alloy for Mobile Phone Repair, Chip Planting, and Electronic Component Soldering"
brand: "rubik"
price: "HK$160"
currency: HKD
in_stock: true
url: https://www.desertcart.hk/products/554205593-rubik-lead-based-bga-rework-solder-paste-50g-with-tin
store_origin: HK
region: Hong Kong
---

# Optimized for mobile phone repair Precision BGA rework compatibility Viscosity & graininess controlled Rubik Lead-Based BGA Rework Solder Paste 50g with Tin-Lead Alloy for Mobile Phone Repair, Chip Planting, and Electronic Component Soldering

**Brand:** rubik
**Price:** HK$160
**Availability:** ✅ In Stock

## Summary

> 🔩 Master your solder game with Rubik’s precision paste!

## Quick Answers

- **What is this?** Rubik Lead-Based BGA Rework Solder Paste 50g with Tin-Lead Alloy for Mobile Phone Repair, Chip Planting, and Electronic Component Soldering by rubik
- **How much does it cost?** HK$160 with free shipping
- **Is it available?** Yes, in stock and ready to ship
- **Where can I buy it?** [www.desertcart.hk](https://www.desertcart.hk/products/554205593-rubik-lead-based-bga-rework-solder-paste-50g-with-tin)

## Best For

- rubik enthusiasts

## Why This Product

- Trusted rubik brand quality
- Free international shipping included
- Worldwide delivery with tracking
- 15-day hassle-free returns

## Key Features

- • **Compact 50g Tube:** Portable and convenient size ideal for professional workshops and on-the-go repairs.
- • **Effortless Application:** Smooth paste texture ensures easy handling and precise placement on tiny components.
- • **Tailored for Mobile Tech:** Specifically engineered for mobile phone repairs and delicate chip planting tasks.
- • **Consistent High-Quality Joints:** Achieve flawless soldering every time with perfectly balanced viscosity and grain size.
- • **Reliable BGA Rework Performance:** Designed to meet the demands of complex ball grid array soldering with superior adhesion.

## Overview

Rubik Lead-Based BGA Rework Solder Paste (50g) features a tin-lead alloy optimized for mobile phone repair, chip planting, and electronic component soldering. Its controlled viscosity and graininess deliver consistent, high-quality solder joints, making it a trusted choice for professional BGA rework and precision electronics tasks.

## Description

Rubik lead-based BGA rework solder paste with a tin-lead alloy. It is ideal for mobile phone repair, chip planting, and electronic component soldering applications. The solder paste is easy to use and produces high-quality solder joints. It is also viscosity and graininess controlled, ensuring a consistent and reliable performance.

## Features

- Rubik solder paste is easy to use and produces high-quality solder joints.
- It is viscosity and graininess controlled, ensuring a consistent and reliable performance.
- Ideal for BGA rework, mobile phone repair, chip planting, and electronic component soldering applications
- Package Includes: 1 x Rubik soldering paste, Net weight 50grams.

## Technical Specifications

| Specification | Value |
|---------------|-------|
| Manufacturer | Rubik |
| Item Weight | 60 g |
| Package Dimensions | 11.4 x 9.6 x 3 cm; 60 g |
| Item model number | RBJSD-18S |

## Images

![Rubik Lead-Based BGA Rework Solder Paste 50g with Tin-Lead Alloy for Mobile Phone Repair, Chip Planting, and Electronic Component Soldering - Image 1](https://m.media-amazon.com/images/I/51SKjGOLFGL.jpg)

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**Shop now:** [https://www.desertcart.hk/products/554205593-rubik-lead-based-bga-rework-solder-paste-50g-with-tin](https://www.desertcart.hk/products/554205593-rubik-lead-based-bga-rework-solder-paste-50g-with-tin)

---

*Product available on Desertcart Hong Kong*
*Store origin: HK*
*Last updated: 2026-01-28*